The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...
IMDEA and UPM have developed deformable woven nitinol metamaterials that combine metal strength with textile flexibility.
With the dynamic growth and ubiquity of electronic systems globally, software-defined, AI-powered, and silicon-enabled technologies are critical for today’s semiconductor industry, which is projected ...
Cadence and SPIE joint-funded scholarship will benefit graduate students studying advanced lithography or a related fieldBELLINGHAM, Wash.--(BUSINESS WIRE)--SPIE, the international society of optics ...
Microsoft validates Itransition’s AI expertise with AI Platform on Microsoft Azure specialization, recognizing its ...
DUBAI, UNITED ARAB EMIRATES, UNITED ARAB EMIRATES, January 28, 2026 /EINPresswire.com/ -- In a significant step towards ...
The second edition of the research firm’s InferenceMAX benchmark, now known as InferenceX, saw Nvidia’s GB300 NVL72 system as the king of the hill, boasting performance levels of up to 100x over a ...
By merging 2bcloud into Sela... we’re significantly advancing our shared mission to build the world’s #1 cloud and AI ...
A new thesis argues crypto built for AI agents explains rigid design choices and points to self-driving wallets as the next ...
Featuring Anna Covert and Sam Frentzel-Beyme AI adoption goes beyond technology—it’s driven by leadership and strategy, ...
Airflow Sciences Corporation has been awarded $1.15 Million from the U.S. Department of Energy to develop a specialized ...
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