Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Most Identity and Access Management (IAM) programs don’t fail spectacularly in a single public incident. Even in highly regulated industries such as financial services, energy, and manufacturing, IAM ...
Abstract: Increasing power consumption and density of highperformance computing (HPC), artificial intelligence (AI), and automotive packages are driving the demand for innovative thermal management ...
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